Sub-Terahertz/Terahertz Silicon Transceivers for Chip-to-Chip Short-Range Wireless Interconnects- Group 1

2021-2022 Spring
Faculty Department of Project Supervisor: 
Faculty of Engineering and Natural Sciences
Number of Students: 

Sub-Terahertz/Terahertz Silicon Transceivers for Chip-to-Chip Short-Range Wireless Interconnects:
One of the major bottleneck in computing systems (high-performance, personal computers, or handheld smart devices), is ever-increasing requirement of broadband wireline data transmission and reception between CPU, GPU, memory and other peripheral chips and/or boards. Wireline interconnect poses several problems including cross-talk between signals that degrades the signal quality, increased delay/latency, increased power consumption etc.
One possible solution is to embed wireless transceivers within these chips instead of wireline connections. For this purpose, sub-terahertz (>100GHz, can also be called as sub-millimeter-wave) and terahertz (=>300GHz) frequency ranges are pronounced extensively owing to much smaller wavelengths compared to common wireless communication frequencies. As a result, on-chip antennas can be integrated with transceivers and decreases system integration complexity with a very small silicon area overhead (hence less cost).
Within this project, we will clearly define the problems for different chip-to-chip or even board-to-board scenarios; define the requirements for chip-to-chip wireless interconnects, e.g. data-rate, wireless communication distance, latency etc., for different application scenarios; and conceptually design/calculate/simulate sub-terahertz/terahertz chip-to-chip wireless transceiver systems. We will simply follow the steps below:
1.  Learning phase and clear definition of the problems for different scenarios, includes the first phase of literature survey. (2-3 weeks)
2.  Deciding on a number of different scenarios (this number will be decided with the number of people enrolled). Project planning/scheduling (1 week)
3+ Simply will be decided at step 2. The rest will definitely includes the followings and can be more; literature survey and benchmarking for chip-to-chip wireless communication systems and its building blocks i.e. sub-terahertz circuits, your proposed chip-to-chip wireless communication systems, calculations and simple simulations (e.g. MATLAB, or ADS) whether the requirements could be satisfied or not with the proposed systems.

Related Areas of Project: 
Computer Science and Engineering
Electronics Engineering
Mechatronics Engineering